BGA Component Reballing Service | Ball Attach & Deballing | RoHS Conversion |
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BGA Reballing

BGA REBALLING

 

SemiPack’s high-reliability Ball Grid Array (BGA) Reballing service can quickly rework BGA components to restore them to their original specifications. We are recognized as a global industry leader in BGA services. SemiPack is ITAR compliant and ISO 9001:2015 registered, allowing us to work with aerospace, defense, and a wide variety of other clients. We are a technology-driven company, allowing us to efficiently and cost-effectively reball BGA components with high compliance standards.

 

Some of SemiPack’s reballing services include:

  •  Commercial Semiconductor Terminations with Tin-Lead (Sn-Pb).
  • RoHS to SnPb conversions
  • SnPb conversions needed by RoHS-compliant manufacturers
  • BGA restoration
  • Low non-recurring engineering (NRE) charges
  • First Time Ball Attachment of LGA/QFN/LCC Packages
  • Reball of BGAs with High Melting Point (HMP) Spheres
  • Reball of BGAs with Plastic Core Solder Balls (PCSB)
  • Laser Balling on Specialist Substrates

BGA Restoration & BGA Reballing Services to Meet IEC TS 62647-4 Compliance

In addition to BGA component reballing, we have a full staff of experienced engineers and operators to support your BGA component restoration needs and meet IEC TS 62647-4 compliance. Our BGA component reballing services or BGA component restoration services, provide you with a single source to meet project demands while meeting the highest quality standards.

Our commitment to quality and to maintaining the highest levels of certifications in the industry allow us to work with electronics manufacturers ranging from aerospace and defense to medical and robotics. These certifications and registrations include ITAR, ISO 9001:2015, AS9100 Rev. D, and more. Click here for a full list of our qualifications. When you require the highest standards, SemiPack is the company to turn to for BGA reballing and restoration services.

BGA RESTORATION