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SemiPack is proud to offer a complete preparation and packaging solution; we represent a vital link in the manufacture of electronics and are committed to providing our clients with world class service that exceeds expectations. We utilize a diverse group of advanced preparation and packaging equipment from manufacturers including Q Corp., Systemation, V Tek, Lightener, and Microscan Corp. Our operators are highly trained and certified in the use of the equipment. Our services are conducted in accordance with IS9001/QS9000 standards. IS/QS certification will be completed in 2004. Our team has over 60 years of combined industry experience. Our services are utilized throughout the electronics industry, and our excellence is affirmed by our outstanding list of customers, who serve as the number one source of our new business via referrals. Our services are distinguished by our 4 operational priorities: PRICING, QUALITY, TURN-AROUND, & DELIVERY.
PCB Board Repair
- Damaged pads, traces are among the many items that we repair to exacting IPC Standards. Our technicians have been educated and certified by our IPC Instructors with one of the industry's leading educational programs for our employee's. They are certified in both IPC 610 and IPC 7711/7721 Standards.
Tinning
- Semipack can tin your components to IPC standards and meet your most demanding deadlines.
Tape & Reel Packaging
- Tape & Reel packaging is the preferred method for electronics manufacture. We offer packaging of stock and custom SMT, radial, and axial components on tape and reel according to exacting EIA specifications. We guarantee delivery on most orders within 2-3 days, and have the capability to package and ship immediately if required.
Lead Forming
- Lead forming is a critical step in the electronics manufacturing process. We have the capability to form leads of a vast assortment of specifications. We utilize Hepco lead forming equipment, considered the industry-standard.
Baking
- Electronic device packages can absorb moisture throughout their life span before being mounted on a circuit board, which can cause defects. We offer baking of components in our specialized ovens, followed by dry-packing in moisture barrier bags with a desiccant and moisture indicator card, ensuring devices will be protected from this problem.
Lead Straightening
- During the transportation, handling, and manufacture of circuit boards, the leads on components are frequently bent. We offer rework of components with bent leads, reworking components until they meet specification, or if irreparable then returning component with no charge.
BGA Rework
- With certain chip prices reaching hundreds of dollars or more, it is often cost-effective to reball defective Ball Grid Array (BGA) chips. We have the expertise and infrastructure to meet all your BGA rework needs.
Packaging Materials
- SemiPack maintains a large inventory of common and specialized carrier tape, cover tape, anti-stat bags, and reels that are available for purchase. We predominantly carry Advantek and 3M carrier tape. SemiPack joint venture AA Technical Solutions manufactures and markets 13" anti-static carrier tape reels. Additionally, we carry nitrile gloves, clean room wipes, and boxes.
Programming
- Semipack can program virtually any component on a quick turn basis. We will set up dedicated net access for your needs, and provide quick turnarounds at no extra charge to meet your exacting JIT schedules. Stop the delays with distributors and let us help you lower your costs and increase your throughput!
All work is conducted in accordance with our Quality Policy.
QUALITY POLICY:
We are committed to excellence, which will result in outstanding pricing, quality, turn around and delivery that exceeds our customers’ expectations.
Semipack
Technical Services, Inc. Objectives for Total Quality
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