SemiPack Services is an Electronic Manufacturing Support Service to the semiconductor industry. We specialize in BGA reballing, tape and reel, automated tinning services, and more to high-mix low-volume (HMLV) customers. SSI is proud to be GEIA-006 and IEC TS 62647-4 compliant. We are also International Traffic in Arms Regulations (ITAR), AS9100:2009, Rev. D, and ISO 9001:2015 registered
SemiPack’s fully automated tinning services restore the finish of leads for both through-hole and surface mount devices. We tin components for a wide variety of applications and adhere to military specifications, including the Government Electronics and Information Technology Association (GEIA) specifications.
SemiPack has a wide variety of trim and form tooling, including tooling for fine pitch devices. We offer trim and form processes for through-hole devices with both axial and radial lead. Our capabilities range from fully automatic to manual processing; cropping and forming; and lead forming to meet clients’ exact specifications.
SemiPack provides rapid and flexible taping per industry standards. Our tape and reel operations support a wide variety of standard surface mount, radial, and custom component package types. SemiPack’s key advantage is an inventory of over 4,000 pockets, including hard-to-find component pockets.
SemiPack offers BGA reballing services and BGA restoration services with speed, reliability, and affordability that is unrivaled in the electronics manufacturing industry. SemiPack provides electronics manufacturers with a single source to meet reball project demands while reaching the highest quality of standards.