Category Archive: Tin Whiskers

Tin Whiskers vs. Metal Dendrites: What’s the Difference?

Tin whiskers and metal dendrites are structural formations that appear in tin materials during manufacturing and finishing processes. While metal dendrites have been a long-identified metal fabrication problem, the discovery of tin whiskers came more recently. The two seem similar to the untrained eye, making it difficult to tell the difference between the two structural […]

Read More

4 Tips for Preventing Tin Whiskers

Tin plating—i.e., a process that involves coating a substrate with layers of tin—is commonly used during the manufacture of printed circuit boards (PCBs). It is used to protect the copper traces from corrosion, oxidation, and other possible forms of degradation during production and use. As tin is readily available, easily solderable, and highly corrosion-resistant, it […]

Read More