Over the past 11+ years, SemiPack Services has continually invested mechanical and process engineering support in an effort to refine the skill sets and available technologies for our BGA modification operations. With the implementation of full robotic automation in concert with the alignment and placement of solder spheres technology, SemiPack has developed expertise in processing Die-Size (Micro) BGAs as small as 1mm by 1mm with exact placement, alignment, and ball attach, as well as the larger footprints of 30mm by 30mm.
SemiPack’s FR-1418 BGA system is a self-contained metrology unit. It consists of a non-contact confocal chromatic white light line sensor with one or more objectives, a two-axis frictionless linear motor system, a computer, and proprietary analysis software. SemiPack has implemented and dedicated its capabilities to have full robotic technology for these larger footprints with automation from RPS’ Vector 360, which provides both conversions RoHS (Lead-Free) to Solder (63/37) and Leaded (Sn63/Pb37) to Lead-Free (SAC 305). SemiPack Services continues to re-invest in its BGA modification operations to meet the demands in both the growth rate and advancements in technologies and automaton.
SemiPack Services is ISO 9001/AS9100 Rev D certified/ & ITAR registered, providing the military, aerospace/avionics, commercial, and automotive markets the highest quality expected for BGA reballed devices. Our qualification standards follow the protocol listed in IEC/TS 62647-4, Process Management for Avionics & Defense Systems that contain Lead-Free Solder. These technologies and expertise afford SemiPack Services to meet the quick-turn demand at both the low-volume pre-production applications as well as the high-volume production requirements and sets us apart as a global provider for these BGA value-added services.